- All sections
- C - Chemistry; metallurgy
- C23F - Non-mechanical removal of metallic material from surfaces; inhibiting corrosion of metallic material; inhibiting incrustation in general; multi-step processes for surface treatment of metallic material involving at least one process provided for in class and at least one process covered by subclass or or class
- C23F 1/00 - Etching metallic material by chemical means
Patent holdings for IPC class C23F 1/00
Total number of patents in this class: 1902
10-year publication summary
170
|
147
|
109
|
70
|
46
|
29
|
21
|
17
|
8
|
8
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Tokyo Electron Limited | 11599 |
273 |
Applied Materials, Inc. | 16587 |
169 |
Lam Research Corporation | 4775 |
168 |
Hitachi High-Tech Corporation | 4424 |
40 |
Samsung Electronics Co., Ltd. | 131630 |
29 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
26 |
Samsung Display Co., Ltd. | 30585 |
25 |
Novellus Systems, Inc. | 559 |
25 |
Kokusai Electric Corporation | 1791 |
23 |
Micron Technology, Inc. | 24960 |
20 |
Varian Semiconductor Equipment Associates, Inc. | 1282 |
16 |
ASM IP Holding B.V. | 1715 |
14 |
Kioxia Corporation | 9847 |
14 |
Texas Instruments Incorporated | 19376 |
12 |
Dai Nippon Printing Co., Ltd. | 3891 |
12 |
Screen Holdings Co., Ltd. | 2431 |
12 |
United Microelectronics Corp. | 3921 |
11 |
CMC Materials LLC | 254 |
11 |
The Regents of the University of California | 18943 |
10 |
ULVAC, Inc. | 1448 |
10 |
Other owners | 982 |